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Reorganize config files, remove unused config.

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This commit is contained in:
Lukas Steiner
2023-02-23 17:02:21 +01:00
parent 39b456d837
commit c4ca3d71d7
292 changed files with 865 additions and 2998 deletions
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47
tests/tests_regression/HBM2/configs/amconfigs/am_hbm2_8Gb_pc_brc.json
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@@ -1,47 +0,0 @@
{
"CONGEN": {
"CHANNEL_BIT":[
30
],
"BANKGROUP_BIT":[
28,
29
],
"BANK_BIT": [
26,
27
],
"BYTE_BIT": [
0,
1,
2,
3
],
"COLUMN_BIT": [
4,
5,
6,
7,
8,
9,
10
],
"ROW_BIT": [
11,
12,
13,
14,
15,
16,
17,
18,
19,
20,
21,
22,
23,
24,
25
]
}
}

14
tests/tests_regression/HBM2/configs/mcconfigs/fifoStrict.json
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@@ -1,14 +0,0 @@
{
"mcconfig": {
"PagePolicy": "Closed",
"Scheduler": "Fifo",
"RequestBufferSize": 8,
"CmdMux": "Strict",
"RespQueue": "Fifo",
"RefreshPolicy": "NoRefresh",
"RefreshMaxPostponed": 0,
"RefreshMaxPulledin": 0,
"PowerDownPolicy": "NoPowerDown",
"PowerDownTimeout": 100
}
}

48
tests/tests_regression/HBM2/configs/memspecs/HBM2.json
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@@ -1,48 +0,0 @@
{
"memspec": {
"memarchitecturespec": {
"burstLength": 4,
"dataRate": 2,
"nbrOfBankGroups": 4,
"nbrOfBanks": 16,
"nbrOfColumns": 128,
"nbrOfPseudoChannels": 1,
"nbrOfChannels": 2,
"nbrOfDevices": 1,
"nbrOfRows": 32768,
"width": 128
},
"memoryId": "https://www.computerbase.de/2019-05/amd-memory-tweak-vram-oc/#bilder",
"memoryType": "HBM2",
"memtimingspec": {
"CCDL": 3,
"CCDS": 2,
"CKE": 8,
"DQSCK": 1,
"FAW": 16,
"PL": 0,
"RAS": 28,
"RC": 42,
"RCDRD": 12,
"RCDWR": 6,
"REFI": 3900,
"REFISB": 244,
"RFC": 220,
"RFCSB": 96,
"RL": 17,
"RP": 14,
"RRDL": 6,
"RRDS": 4,
"RREFD": 8,
"RTP": 5,
"RTW": 18,
"WL": 7,
"WR": 14,
"WTRL": 9,
"WTRS": 4,
"XP": 8,
"XS": 216,
"clkMhz": 1000
}
}
}

19
tests/tests_regression/HBM2/configs/simulator/hbm2.json
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@@ -1,19 +0,0 @@
{
"simconfig": {
"AddressOffset": 0,
"CheckTLM2Protocol": false,
"DatabaseRecording": true,
"Debug": false,
"ECCControllerMode": "Disabled",
"EnableWindowing": false,
"ErrorCSVFile": "",
"ErrorChipSeed": 42,
"PowerAnalysis": false,
"SimulationName": "hbm2",
"SimulationProgressBar": true,
"StoreMode": "NoStorage",
"ThermalSimulation": false,
"UseMalloc": false,
"WindowSize": 1000
}
}

15
tests/tests_regression/HBM2/configs/thermalsim/config.json
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@@ -1,15 +0,0 @@
{
"thermalsimconfig": {
"TemperatureScale": "Celsius",
"StaticTemperatureDefaultValue": 89,
"ThermalSimPeriod":100,
"ThermalSimUnit":"us",
"PowerInfoFile": "powerInfo.json",
"IceServerIp": "127.0.0.1",
"IceServerPort": 11880,
"SimPeriodAdjustFactor" : 10,
"NPowStableCyclesToIncreasePeriod": 5,
"GenerateTemperatureMap": true,
"GeneratePowerMap": true
}
}

45
tests/tests_regression/HBM2/configs/thermalsim/core.flp
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@@ -1,45 +0,0 @@
CPUs :
position 0, 0 ;
dimension 2750, 4300 ;
GPU :
position 3350, 0 ;
dimension 2750, 4000 ;
BASEBAND1 :
position 4250, 4000 ;
dimension 1850, 3300 ;
BASEBAND2 :
position 3350, 7300 ;
dimension 2750, 3300 ;
LLCACHE :
position 0, 4300 ;
dimension 1900, 3000 ;
DRAMCTRL1 :
position 1900, 4300 ;
dimension 850, 3000 ;
DRAMCTRL2 :
position 3350, 4000 ;
dimension 900, 3300 ;
TSVS :
position 2750, 2300 ;
dimension 600, 6000 ;
ACELLERATORS :
position 0, 7300 ;
dimension 2750, 3300 ;

16
tests/tests_regression/HBM2/configs/thermalsim/mem.flp
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@@ -1,16 +0,0 @@
channel0 :
position 150, 100 ;
dimension 2600, 5200 ;
channel1 :
position 3350, 100 ;
dimension 2600, 5200 ;
channel2 :
position 150, 5300 ;
dimension 2600, 5200 ;
channel3 :
position 3350, 5300 ;
dimension 2600, 5200 ;

20
tests/tests_regression/HBM2/configs/thermalsim/powerInfo.json
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@@ -1,20 +0,0 @@
{
"powerInfo": {
"dram_die_channel0": {
"init_pow": 0,
"threshold": 1.0
},
"dram_die_channel1": {
"init_pow": 0,
"threshold": 1.0
},
"dram_die_channel2": {
"init_pow": 0,
"threshold": 1.0
},
"dram_die_channel3": {
"init_pow": 0,
"threshold": 1.0
}
}
}

49
tests/tests_regression/HBM2/configs/thermalsim/stack.stk
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@@ -1,49 +0,0 @@
material SILICON :
thermal conductivity 1.30e-4 ;
volumetric heat capacity 1.628e-12 ;
material BEOL :
thermal conductivity 2.25e-6 ;
volumetric heat capacity 2.175e-12 ;
material COPPER :
thermal conductivity 4.01e-04 ;
volumetric heat capacity 3.37e-12 ;
top heat sink :
//sink height 1e03, area 100e06, material COPPER ;
//spreader height 0.5e03, area 70e06, material SILICON ;
heat transfer coefficient 1.3e-09 ;
temperature 318.15 ;
dimensions :
chip length 6100, width 10600 ;
cell length 100, width 100 ;
layer PCB :
height 10 ;
material BEOL ;
die DRAM :
layer 58.5 SILICON ;
source 2 SILICON ;
layer 1.5 BEOL ;
layer 58.5 SILICON ;
stack:
die DRAM_DIE DRAM floorplan "./mem.flp" ;
layer CONN_TO_PCB PCB ;
solver:
transient step 0.01, slot 0.05 ;
initial temperature 300.0 ;
output:
Tflpel(DRAM_DIE.channel0 , "temp_flp_element_ch0.txt" , average , slot );
Tflpel(DRAM_DIE.channel1 , "temp_flp_element_ch1.txt" , average , slot );
Tflpel(DRAM_DIE.channel2 , "temp_flp_element_ch2.txt" , average , slot );
Tflpel(DRAM_DIE.channel3 , "temp_flp_element_ch3.txt" , average , slot );
Tmap (DRAM_DIE, "output1.txt", slot) ;
Pmap (DRAM_DIE, "output2.txt", slot) ;

135
tests/tests_regression/HBM2/hbm2-example.json Normal file
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@@ -0,0 +1,135 @@
{
"simulation": {
"addressmapping": {
"CHANNEL_BIT": [
30
],
"BANKGROUP_BIT": [
28,
29
],
"BANK_BIT": [
26,
27
],
"BYTE_BIT": [
0,
1,
2,
3
],
"COLUMN_BIT": [
4,
5,
6,
7,
8,
9,
10
],
"ROW_BIT": [
11,
12,
13,
14,
15,
16,
17,
18,
19,
20,
21,
22,
23,
24,
25
]
},
"mcconfig": {
"PagePolicy": "Closed",
"Scheduler": "Fifo",
"RequestBufferSize": 8,
"CmdMux": "Strict",
"RespQueue": "Fifo",
"RefreshPolicy": "NoRefresh",
"RefreshMaxPostponed": 0,
"RefreshMaxPulledin": 0,
"PowerDownPolicy": "NoPowerDown",
"PowerDownTimeout": 100
},
"memspec": {
"memarchitecturespec": {
"burstLength": 4,
"dataRate": 2,
"nbrOfBankGroups": 4,
"nbrOfBanks": 16,
"nbrOfColumns": 128,
"nbrOfPseudoChannels": 1,
"nbrOfChannels": 2,
"nbrOfDevices": 1,
"nbrOfRows": 32768,
"width": 128
},
"memoryId": "https://www.computerbase.de/2019-05/amd-memory-tweak-vram-oc/#bilder",
"memoryType": "HBM2",
"memtimingspec": {
"CCDL": 3,
"CCDS": 2,
"CKE": 8,
"DQSCK": 1,
"FAW": 16,
"PL": 0,
"RAS": 28,
"RC": 42,
"RCDRD": 12,
"RCDWR": 6,
"REFI": 3900,
"REFISB": 244,
"RFC": 220,
"RFCSB": 96,
"RL": 17,
"RP": 14,
"RRDL": 6,
"RRDS": 4,
"RREFD": 8,
"RTP": 5,
"RTW": 18,
"WL": 7,
"WR": 14,
"WTRL": 9,
"WTRS": 4,
"XP": 8,
"XS": 216,
"clkMhz": 1000
}
},
"simconfig": {
"AddressOffset": 0,
"CheckTLM2Protocol": false,
"DatabaseRecording": true,
"Debug": false,
"ECCControllerMode": "Disabled",
"EnableWindowing": false,
"ErrorCSVFile": "",
"ErrorChipSeed": 42,
"PowerAnalysis": false,
"SimulationName": "hbm2",
"SimulationProgressBar": true,
"StoreMode": "NoStorage",
"ThermalSimulation": false,
"UseMalloc": false,
"WindowSize": 1000
},
"simulationid": "hbm2-example",
"tracesetup": [
{
"clkMhz": 1000,
"name": "trace1_test4.stl"
},
{
"clkMhz": 1000,
"name": "trace2_test4.stl"
}
]
}
}

20
tests/tests_regression/HBM2/simulations/hbm2-example.json
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@@ -1,20 +0,0 @@
{
"simulation": {
"addressmapping": "am_hbm2_8Gb_pc_brc.json",
"mcconfig": "fifoStrict.json",
"memspec": "HBM2.json",
"simconfig": "hbm2.json",
"simulationid": "hbm2-example",
"thermalconfig": "config.json",
"tracesetup": [
{
"clkMhz": 1000,
"name": "trace1_test4.stl"
},
{
"clkMhz": 1000,
"name": "trace2_test4.stl"
}
]
}
}