README updated.

- Added information on 3D-ICE installation and running.
- Added references to 3D-ICE papers as requested by 3D-ICE authors in the project's website.

README.md

@@ -115,7 +115,7 @@ $ ./traceAnalyzer
 
 ### DRAMSys Thermal Simulation 
 
-  This feature can be enabled via an environment variable.
+This feature can be enabled via an environment variable.
 
 ``` bash
 $ export THERMALSIM=true
@@ -132,6 +132,26 @@ $ qmake ../DRAMSys/dram.vp.system.pro
 $ make
 ```
 
+The thermal simulation is performed by a **3D-ICE** [8] server accessed
+through the network. Therefore users interested in thermal simulation during
+their DRAMSys simulations need to make sure they have a 3D-ICE server up and
+running before starting.
+
+More information about how to obtain 3D-ICE and its installation can be
+obtained in the official website http://esl.epfl.ch/3D-ICE.
+
+Provided the user fulfilled this installation requisite, before starting
+DRAMSys it is necessary to run the 3D-ICE server passing to it two arguments:
+a suitable configuration file and an Internet socket port number.
+
+``` bash
+$ 3D-ICE-Server <stack file> <port>
+```
+
+The IP address and the port number related to the server shall be informed in
+DRAMSys' configuration to subsequent use by DRAMSys to access the thermal
+simulation server.
+
 ### DRAMSys Configuration
 
 The **dramSys** executable supports one argument which is a XML file that
@@ -448,4 +468,20 @@ C. Weis, M. Jung, P. Ehses, C. Santos, P. Vivet, S. Goossens, M. Koedam, N. Wehn
 
 [7] http://www.uni-kl.de/3d-dram/publications/
 
+[8] A Sridhar, A Vincenzi, D Atienza, T Brunschwiler, 3D-ICE: a compact
+thermal model for early-stage design of liquid-cooled ICs, IEEE Transactions
+on Computers (TC 2013, accepted for publication).
+
+[9] A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza, 3D-ICE: Fast
+compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling,
+Proceedings of the 2010 International Conference on Computer-Aided Design
+(ICCAD 2010), San Jose, CA, USA, November 7-11 2010.
+
+[10] A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza, Compact
+transient thermal model for 3D ICs with liquid cooling via enhanced heat
+transfer cavity geometries, Proceedings of the 16th International Workshop on
+Thermal Investigations of ICs and Systems (THERMINIC'10), Barcelona, Spain,
+6-8 October, 2010.
+
+[11] http://esl.epfl.ch/3D-ICE